CM to lay stone for country’s 1st advanced chip packaging unit today
Odisha's capital is set to host India's first advanced 3D glass semiconductor packaging unit, a Rs 1,943 crore project by 3D Glass Solutions. This facility will introduce sophisticated chip packaging technology, create 2,500 jobs, and bolster India's semiconductor capabilities, particularly for strategic sectors like aerospace and AI.
Odisha's capital is set to host India's first advanced 3D glass semiconductor packaging unit, a Rs 1,943 crore project by 3D Glass Solutions. This facility will introduce sophisticated chip packaging technology, create 2,500 jobs, and bolster India's semiconductor capabilities, particularly for strategic sectors like aerospace and AI.
